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Supply and Licensing Agreement Between Quatech, Inc. and Socket Mobile, Inc

Requirements Supplier Agreement

Supply and Licensing Agreement Between Quatech, Inc. and Socket Mobile, Inc | Document Parties: QuaTech, Inc | Socket Mobile, Inc You are currently viewing:
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Title: Supply and Licensing Agreement Between Quatech, Inc. and Socket Mobile, Inc
Governing Law: Ohio     Date: 10/6/2009
Industry: Semiconductors     Sector: Technology

Supply and Licensing Agreement Between Quatech, Inc. and Socket Mobile, Inc, Parties: quatech  inc , socket mobile  inc
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Exhibit 10.2

Supply and Licensing Agreement Between
Quatech, Inc. and
Socket Mobile, Inc.

This Agreement, effective as of September 30, 2009 (“Effective Date”), is made and entered into by and between QuaTech, Inc., (“QUATECH”), an Ohio Corporation with its principal place of business at 5675 Hudson Industrial Parkway, Hudson, Ohio 44236 and Socket Mobile, Inc. (“SOCKET”), a Delaware Corporation, having its principal place of business at 39700 Eureka Drive, Newark, California 94560, collectively hereafter referred to as the “Parties”. QUATECH is a wholly owned subsidiary of DPAC Technologies Corp., a California Corporation, located at 5675 Hudson Industrial Parkway, Hudson, Ohio 44236.

WHEREAS SOCKET is selling to QUATECH the designs, engineering specifications and related documentation, software drivers and exclusive marketing rights for its serial products under an Asset Purchase Agreement dated September 30, 2009 (“Purchase Agreement”);

WHEREAS the sale of the serial products to QUATECH includes the right for QUATECH to manufacture or have manufactured the serial products. In connection with this right, QUATECH and SOCKET have agreed for QUATECH to purchase SOCKET’s HIS3 chip from SOCKET under this Agreement;

WHEREAS the serial products being sold to QUATECH include SOCKET’S Cordless Serial Adapter (“CSA”), QUATECH and SOCKET have agreed the purchase of the CSA only includes the design implementation currently being marketed and sold along with SOCKET’s serial products and SOCKET shall license to QUATECH hereunder SOCKET’S firmware implemented within the CSA that provides Bluetooth functionality along with the CSA’s Configuration Utilities.

NOW THEREFORE in consideration for the mutual covenants and obligations set forth herein, the parties hereby agree as follows:

1.

 

TERM

 

 

 

The term of this Agreement shall commence on the Effective Date and shall terminate ten (10) years after such date, unless otherwise terminated or canceled by either party as provided herein. This Agreement shall automatically renew for additional one (1) year terms unless one of the Parties notifies the other in writing that it does not desire to renew the Agreement at least sixty (60) days prior to the expiration date.

QUATECH and SOCKET Supply Agreement

 

 


 

2.

 

PRODUCTS

 

 

 

HIS3 Chip The HIS3 chip is an interface chip owned and manufactured by SOCKET and used in SOCKET products including its serial products as more fully described in Appendix A. This Agreement enables QUATECH to purchase the HIS3 Chip from Socket for use in all QUATECH products (including but not limited to the CSA)(“QUATECH Products”).

 

 

 

Socket Bluetooth BlueLab Application Code and Configurator Utilities (“Software”) . The Bluetooth BlueLab Application Code is the Bluetooth firmware that runs embedded within the CSA. The Configurator Utilities are used on a desktop or notebook computer to configure the BlueLab Application Code firmware when the CSA is plugged into a desktop or notebook. The Software is described in more detail in Appendix B. This Agreement licenses QUATECH to distribute this Software with the CSA purchased under the Purchase Agreement.

 

 

 

CSA Product . A limited quantity of the Cordless Serial Adapter product is available due to the end of life status of the BC02 Bluetooth chip designed into this product. SOCKET has manufactured and holds in its inventory approximately 1,700 CSA units. SOCKET agrees to hold these units for purchase by QUATECH, and QUATECH agrees to purchase these units no later than March 31, 2010 at SOCKET’s cost of $35.24 per unit. In addition, SOCKET has in its inventory approximately 2,100 BC02 modules at a cost of $15.65 per unit which have been removed from SOCKET’s price lists as an end of life product. These modules represent the likely last available supply that could be used to build additional CSA products. QUATECH agrees to advise SOCKET no later than November 30, 2009 whether QUATECH will commit to a) purchase some or all of these modules or b) instruct SOCKET to build additional CSA products with these modules that QUATECH will commit to purchase and which SOCKET agrees to build if so ordered by QUATECH. After November 30, 2009 or upon being advised by QUATECH that some or all of the BCO2 modules are not needed, SOCKET has the right to dispose of any BC02 modules not needed by QUATECH.

 

3.

 

SOFTWARE AND TEMPORARY LICENSE OF SOCKET MOBILE I/P

 

 

 

License and Distribution Rights . QUATECH is granted a worldwide perpetual royalty free license to use, display and distribute the Software and related technical and user documentation in object code format with the CSA product acquired under the Purchase Agreement. SOCKET shall supply QUATECH with master copies of the Software (including source code of the Configurator Utilities ) along with all technical and user documentation that describes the use of the Software. QUATECH is also granted a source code license for the Configurator Utilities and the right to create derivative works of this product and its documentation and to use, modify, display and distribute all such derivative works. QUATECH shall provide SOCKET with a source code copy and related documentation of all derivative works to enable SOCKET to provide second level support for the CSA.

 

 

 

Software Support and Warranty. The Software is supplied “as is”. Bug fixes that correct conditions that keep the Software from operating in accordance with its specifications shall be made by Socket upon request at no charge to QUATECH. All other modifications if any requested by QUATECH shall be made by SOCKET at SOCKET’S discretion at a non-recurring engineering fee to be mutually agreed at the time of such request based on fees common to the industry for software development. SOCKET shall also provide QUATECH with second level technical support in answering technical questions regarding the Software.

 

 

 

Socket Mobile Intellectual Property (I/P) . Socket Mobile I/P used by SOCKET on its serial products consists of the name ‘Socket Mobile’ and the logo ‘Socket’. These marks have been used on labels, data sheets, manuals, product packaging and on driver software. Certain products being purchased by QUATECH may initially contain Socket Mobile I/P. It is the intent of the parties that QUATECH will update and remove Socket Mobile I/P and replace it with Quatech I/P on data sheets, manuals, packaging and driver software and will begin to affix a sticker to product labels or create new labels no later than December 31, 2009. QUATECH is granted a royalty-free license through December 31, 2009 to manufacture and distribute purchased products containing Socket Mobile I/P.

QUATECH and SOCKET Supply Agreement

 

2


 

4.

 

HIS3 CHIP

 

 

 

Right to incorporate the chip into QUATECH Products . QUATECH is granted the right to use the HIS3 chip in all QUATECH Products. The HIS3 chip may not be sold as a stand-alone chip without the express written permission of SOCKET.

 

 

 

Technical Support . QUATECH shall provide first level support to its customers for its serial products containing the HIS3 chip. SOCKET shall provide second level support and training services to QUATECH for the HIS3 chip Monday through Friday during SOCKET’s normal business hours.

 

 

 

Escrow of HIS3 Engineering specification documentation . SOCKET shall arrange to place and keep current the most recent engineering drawings and specifications for its HIS3 chip as defined in the Escrow Service Agreement to be mutually agreed between the parties. The escrow shall be established under a Master Beneficiary Three-Party Escrow Service Agreement between QUATECH, SOCKET and Iron Mountain Intellectual Property Management, Inc. , a copy of which is attached hereto as Appendix C (hereafter referred to as the “Escrow Agreement”). The Escrow Agreement shall provide for the release of the engineering drawings and specifications with a license to manufacture and sell the HIS3 chip for use in QUATECH Products in the event that SOCKET becomes insolvent or otherwise declares bankruptcy, in the event SOCKET breaches this Agreement or in the event SOCKET fails to function as a going concern or to operate in the ordinary course, each as more fully described in the Escrow Agreement.

 

 

 

Warranty of the HIS3 Chip . SOCKET shall warrant the HIS3 chip to perform in accordance with its specifications for a period of fifteen months from date of receipt by QUATECH in accordance with its normal warranty policy as specified in Appendix D.

 

 

 

Sale to Government . If QUATECH sells its QUATECH Products containing the HIS3 chip to the United States Federal Government either directly or indirectly, or through the General Services Administration (“GSA”), California Multiple Award Schedule (“CMAS”), or other government multiple award schedule contracts, SOCKET agrees to provide any representations or certifications to QUATECH or any of QUATECH’S U.S. Federal Government end-users as may be required, including but not limited to a Letter of Supply required to add the QUATECH Products to QUATECH’s GSA Schedule. SOCKET agrees to furnish the HIS3 chips needed by QUATECH to fulfill any GSA, CMAS, or other government multiple award schedule contracts or similar contract obligations under any schedule contract, and to accept any government flow-down provisions, including but not limited to, the United States Government Federal Acquisition Regulations (“FARs”) and its supplements, Defense FARs, or NASA FARs, whether for resale or internal use.

QUATECH and SOCKET Supply Agreement

 

3


 

5.

 

HIS3 CHIP ORDERS/RESCHEDULE RIGHTS

 

 

 

QUATECH shall order HIS3 chips by issuing and delivering to SOCKET written purchase orders (“Purchase Orders”). QUATECH shall order a minimum of 1,000 HIS3 chips per quarter for delivery during the six (6) quarters commencing with the quarter ending December 31, 2009. Delivery dates specified in the Purchase Orders shall be consistent with minimum lead time guidelines supplied by SOCKET from time to time, unless otherwise agreed between the parties. SOCKET shall have three (3) business days within which to either accept or reject a submitted Purchase Order and shall submit an order confirmation to QUATECH . Purchase Orders that are not rejected shall be deemed accepted by SOCKET. Subject to the Purchase Order Reschedule Table referred to below, Purchase Orders are firm and may not be cancelled after acceptance by SOCKET.

 

 

 

Purchase Order Reschedule Table:

 

 

Purchase Orders for delivery dates due within 30 days shall be firm

 

 

Purchase Orders for delivery dates due within 31 days to 60 days may be up to 50% rescheduled

 

 

Purchase Orders for delivery dates due in greater than 60 days may be up to 100% rescheduled

 

 

 

No Purchase Orders may be rescheduled more than three times and for no more than six months in total from the original due date.

 

6.

 

NON-BINDING FORECASTS FOR SUPPLY OF THE HIS3 CHIP

 

 

 

QUATECH shall provide SOCKET at least quarterly a rolling six month non-binding forecast of its requirements for the HIS3 chip to aid SOCKET in planning its manufacturing schedules and inventory levels.

 

7.

 

PRICING

 

 

 

The purchase price for the HIS3 chip will be $19.75 per chip until a cumulative total of 75,000 chips have been purchased by QUATECH under this Agreement. QUATECH may, at its option, place an order with SOCKET for delivery of all 75,000 chips less quantities previously ordered at a price of $15.75 per chip. Delivery dates for this order must be specified within a six month period from the date of order. All HIS3 chips will be shipped FOB Socket’s plant. The price of the HIS3 chip includes the cost of freight. Subsequent to the purchase by QUATECH of the initial 75,000 chips, the purchase price will be reduced to $3.75 per chip.

 

8.

 

SPECIFICATIONS/CHANGES/END OF LIFE

 

 

 

SOCKET shall not make any modifications, improvements, alterations or changes (hereinafter collectively referred to as “Changes”) to the HIS3 chips as listed in the attached Appendix A during the term of this Agreement that affect or may tend to affect form, fit, function, appearance, reliability, or interchangeability without prior notification to QUATECH in writing and only due to changes outside of the control of SOCKET such as technical obsolescence of components of the HIS3 chip. In the event Changes are required, SOCKET shall give QUATECH a minimum of three months written notification of Changes prior to proceeding and shall enable QUATECH to place a last buy order for the current HIS3 chip.

 

 

 

QUATECH may, at its option, request that a test be performed on any Changes to ensure the HIS3 chips as changed comply with Specifications.

QUATECH and SOCKET Supply Agreement

 

4


 

9.

 

PACKAGING

 

 

 

SOCKET shall be responsible to provide packaging for the HIS3 chips of the necessary quality, construction and strength to prevent damage in transit. SOCKET shall bear all costs related to packaging, and to the cartoning and packing, including drayage and palleting, if applicable.

 

10.

 

TRADEMARKS, LOGOS, LABELING

 

 

 

During the term of this Agreement, QUATECH is hereby granted a non-exclusive license to use at its option the trademarks, service marks, trade names, product names, logos, designs, and other designations or brands (the “Marks”) owned by SOCKET relating to the HIS3 chip in connection with identifying that the QUATECH Products contain an HIS3 chip from SOCKET. QUATECH shall not remove or deface any Marks appearing on the HIS3 chips or on any documentation provided by SOCKET hereunder. QUATECH may indicate its relationship to SOCKET and refer to the HIS3 chip and any marks relating thereto provided that such references are truthful and not misleading and SOCKET is designated the owner of the Marks.

 

 

 

QUATECH is not granted any right, title or interest in the SOCKET Marks except as provided for herein and in the Purchase Agreement, and acknowledges SOCKET’s right in and to the Marks and agrees that any and all use of the Marks by QUATECH shall inure to the sole benefit of SOCKET. QUATECH agrees that it shall not take any action inconsistent with the ownership of the Marks and agrees not to challenge SOCKET’s rights in or attempt to register any of the Marks or any mark confusingly similar thereto.

 

 

 

Nothing in this Agreement grants SOCKET any right to use, or right, title or interest in any Marks owned by QUATECH or its affiliates and subsidiaries.

 

11.

 

PAYMENTS

 

 

 

All prices are in U.S. currency. SOCKET shall bill QUATECH at the time that HIS3 chips are shipped. Payments are due forty-five (45) days after QUATECH’s receipt of invoice. In the case of deliveries made in installments, each shipment shall be paid for when delivered and invoiced without regard to the other scheduled deliveries. SOCKET shall not be required to ship additional HIS3 chip to QUATECH while undisputed payments are delinquent (all disputes by QUAT


 
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