FORM OF LIEN RELEASE
AGREEMENT
THIS LIEN RELEASE
AGREEMENT (this “
Agreement ”) is made and entered into this
18th day of March, 2009 by and between Irvine Sensors Corporation,
a Delaware corporation (the “ Company ”),
and the undersigned investor (the “ Investor
”). Each of the Company and the Investor is sometimes
referred to herein as a “ Party ,” and
collectively as the “ Parties
.”
RECITALS
A. WHEREAS,
the Company owes the Investor principal and interest totaling
approximately
$ as
of ,
2009 pursuant to that certain Secured Promissory Note dated as
of in
favor of the Investor (the “ Note
”);
B. WHEREAS,
the Investor is a party to, and the Company’s assets are
secured by liens (the “ Liens ”) pursuant
to, that certain Security Agreement dated as of November 5,
2008 and Intercreditor Agreement dated as of November 5,
2008;
C. WHEREAS
, the Company has entered into an agreement to sell most of its
patent portfolio and related assets (“ Patent
Assets ”) to a patent acquisition company (the
“ Patent Buyer ”) for up to a
$9.5 million cash payment and it is anticipated that the
Company will be granted a perpetual, worldwide, royalty-free,
non-exclusive license to use the sold patents in its business (the
“ Patent Sale and License ”), a condition
to which is a requirement that the Investor agrees to release its
Liens relating to the Patent Assets pursuant to the terms of this
Agreement;
D. WHEREAS,
the parties desire to effect such a release of the Investor’s
Liens relating to the Patent Assets; and
E. WHEREAS,
the Company, U.S. Bank National Association (the “
Escrow Agent ”) and certain holders of the
bridge notes issued by the Company pursuant to that certain Private
Placement Memorandum, dated as of September 29, 2008 and as
supplemented on January 26, 2009, (the “ Bridge
Notes ”) have entered into an Escrow Agreement,
pursuant to which the Company has agreed to deposit out of the
proceeds of the Patent Sale and License an amount equal to
$1,040,000 (the “ Escrow Deposit
”).
AGREEMENT
NOW
THEREFORE, in
consideration of the foregoing and the agreements and covenants
contained herein, the Parties agree as follows:
1. Release
of Liens . As consideration for the
Investor’s release of Liens relating to the Patent Assets,
the Investor agrees as follows ( Please Initial One
):
a. (Initials)
Investor agrees to (i) upon receipt of the outstanding
principal and accrued interest owing under the Note, such amount to
be paid to Investor out of the Escrow Deposit promptly after the
closing of the Patent Sale and License, surrender the Note to the
Company for cancellation and (ii) upon the Escrow
Agent’s receipt of the Escrow Deposit, execute and deliver
the release of Liens relating to the Patent Assets attached hereto
as Exhibit A ; or
b. (Initials)
Investor agrees to (i) upon receipt of the number of shares of
the Company’s common stock (the “ Shares
”) set forth in this Section 1(b), surrender the Note to
the Company for cancellation in exchange for the Company’s
agreement to issue to Investor, subject to approval of the
Company’s stockholders, the number of Shares equal to 125% of
the value of the outstanding principal and accrued interest under
the Note, based on the greater of (a) $0.40, (b) the last
reported closing sale price of the Company’s common stock on
the Nasdaq Capital Market immediately prior to the closing of the
Patent Sale and License and (c) the consolidated closing bid
price of the Company’s common stock on the Nasdaq Capital
Market immediately prior to the closing of the Patent
1
Sale and License and (ii) upon
the Escrow Agent’s receipt of the Escrow Deposit, execute and
deliver the release of Liens relating to the Patent Assets attached
hereto as Exhibit A ; or
c. (Initials)
Investor agrees to (i) upon receipt of the number of Shares
set forth in this Section 1(c) and the amount of principal and
accrued interest set forth in this Section 1(c), surrender the
Note to the Company for cancellation in exchange for the
Company’s agreement to (y) pay Investor
$ of
the outstanding principal and accrued interest under the Note in
cash out of the proceeds of the Patent Sale and License, such
amount to be paid to Investor out of the Escrow Deposit promptly
after the closing of the Patent Sale and License and (z) issue
to Investor, subject to approval of the Company’s
stockholders, the number of Shares equal to 125% of the value of
the remaining
$ of
the outstanding principal and accrued interest under the Note,
based on the greater of (1) $0.40, (2) the last reported
closing sale price of the Company’s Common Stock on the
Nasdaq Capital Market immediately prior to the closing of the
Patent Sale and License and (3) the consolidated closing bid
price of the Company’s Common Stock on the Nasdaq Capital
Market immediately prior to the closing of the Patent Sale and
License and (ii) upon the Escrow Agent’s receipt of the
Escrow Deposit, execute and deliver the release of Liens relating
to the Patent Assets attached hereto as Exhibit A
.
2. Equity
Consideration . In the event the Investor
agrees to either Section 1(b) or 1(c) of this Agreement, the
Company shall use commercially reasonable efforts to obtain
stockholder approval for the issuance of the Shares no later than
the Company’s 2009 Annual Meeting of Stockholders. The
Company shall issue the Shares to the Investor as soon as
practicable after such issuance has been approved by the
Company’s stockholders. If the Company is unable to obtain
stockholder approval for the issuance of the Shares, the Note shall
remain outstanding in accordance with its terms.
3. Governing
Law . This Agreement shall be governed by, and
construed in accordance with, the laws of the State of California
without regard to conflicts of laws that would result in the
application of the substantive laws of another
jurisdiction.
4.
Attorneys’ Fees . If any action or
proceeding in contract or tort arising out of or relating to this
Agreement is commenced by any party to this Agreement, the
prevailing party shall be entitled to receive from the other party,
in addition to any other relief that may be granted, the reasonable
attorneys’ fees, costs and expenses incurred in the action or
proceeding by the prevailing party, along with any reasonable
attorneys’ fees, costs and expenses incurred to collect any
amount awarded in connection with any such action or
proceeding.
5. Waiver of
Jury Trial and Setoff; Consent to Jurisdiction; Etc.
In any litigation in any court with respect to, in
connection with, or arising out of this Agreement or any instrument
or document delivered pursuant to this Agreement, or the validity,
protection, interpretation, collection or enforcement hereof or
thereof, or any other claim or dispute howsoever arising, between
the parties hereto WAIVES TRIAL BY JURY IN CONNECTION WITH ANY SUCH
LITIGATION AND ANY RIGHT IT MAY HAVE TO CLAIM OR RECOVER IN ANY
SUCH LITIGATION ANY SPECIAL, EXEMPLARY, PUNITIVE OR CONSEQUENTIAL
DAMAGES OR ANY DAMAGES OTHER THAN, OR IN ADDITION TO, ACTUAL
DAMAGES. EACH INVESTOR AGREES THAT THIS SECTION 5 IS A
SPECIFIC AND MATERIAL ASPECT OF THIS AGREEMENT AND ACKNOWLEDGE THAT
THE OTHER PARTY WOULD NOT ENTER THIS AGREEMENT IF THIS
SECTION 5 WERE NOT PART OF THIS AGREEMENT. Each party
irrevocably consents to the exclusive jurisdiction of any State or
Federal Court located within the County of Orange, State of
California, in connection with any action or proceeding arising out
of or relating to this Agreement or any document or instrument
delivered pursuant to this Agreement or otherwise. In any such
litigation, each party waives, to the fullest extent it may
effectively do so, personal service of any summons, complaint or
other process and agree that the service thereof may be made by
certified or registered mail directed to such party at its address
for notice determined in accordance with this Section 5. Each
party hereby waives, to the fullest extent it may effectively do
so, the defenses of forum non conveniens and improper
venue.
6.
Representation by Counsel . The Parties
acknowledge and agree that they have been represented or have had
the opportunity to be represented by counsel of their own choice in
the negotiations leading to their execution of this Agreement and
that they have read this Agreement. The Parties further acknowledge
that the waivers they made herein are knowing, conscious and with
full appreciation that they are forever foreclosed from pursuing
any of the rights so waived and that they understand this Agreement
and are signing it voluntarily and without coercion.
2
7.
Admissibility of this Agreement . Each of
the parties agrees that any copy of this Agreement signed by it and
transmitted by facsimile for delivery to the other party shall be
admissible in evidence as the original itself in any judicial or
administrative proceeding, whether or not the original is in
existence.
8.
Notices . All notices, demands, requests,
consents, approvals, and other communications required or permitted
hereunder shall be in writing and, unless otherwise specified
herein, shall be (i) personally served, (ii) deposited in
the mail, registered or certified, return receipt requested,
postage prepaid, (iii) delivered by reputable overnight
courier service with charges prepaid, or (iv) transmitted by
hand delivery, electronic mail, or facsimile, addressed as set
forth on the signature page hereto or to such other address as such
party shall have specified most recently by written notice. Any
notice or other communication required or permitted to be given
hereunder shall be deemed effective (a) upon hand delivery or
delivery by electronic mail or facsimile, with accurate
confirmation generated by the transmitting facsimile machine, at
the address or number designated below (if delivered on a business
day during normal business hours where such notice is to be
received), or the first business day following such delivery (if
delivered other than on a business day during normal business hours
where such notice is to be received) or (b) on the second
business day following the date of mailing by express courier
service, fully prepaid, addressed to such address, or upon actual
receipt of such mailing, whichever shall first occur.
9.
Amendments and Modification. No provision
hereof shall be modified, altered, waived or limited except by
written instrument expressly referring to this Agreement and to
such provision, and executed by the parties hereto.
10.
Counterparts/Execution . This Agreement
may be executed in any number of counterparts and by the different
signatories hereto on separate counterparts, each of which, when so
executed, shall be deemed an original, but all such counterparts
shall constitute but one and the same instrument. This Agreement
may be executed by facsimile signature and delivered
electronically.
11.
Successors and Assigns . Whenever in this
Agreement reference is made to any party, such reference shall be
deemed to include the successors, assigns, heirs and legal
representatives of such party. No party hereto may transfer any
rights under this Agreement, unless the transferee agrees to be
bound by, and comply with all of the terms and provisions of this
Agreement, as if an original signatory hereto on the date
hereof.
12.
Severability . In the event that any term
or provision of this Agreement shall be finally determined to be
superseded, invalid, illegal or otherwise unenforceable pursuant to
applicable law by an authority having jurisdiction and venue, that
determination shall not impair or otherwise affect the validity,
legality or enforceability (i) by or before that authority of
the remaining terms and provisions of this Agreement, which shall
be enforced as if the unenforceable term or provision were deleted,
or (ii) by or before any other authority of any of the terms
and provisions of this Agreement provided each party is able to
receive the substantial benefit of this Agreement.
13. Entire
Agreement . This Agreement contains the entire
agreement of the parties and supersedes all other agreements and
understandings, oral or written, with respect to the matters
contained herein.
[SIGNATURE
PAGE FOLLOWS]
3
IN WITNESS
WHEREOF ,
this Agreement has been executed to be effective as of the date and
year first above written. This Agreement may be executed in
counterparts, each of which shall be deemed an original, but all of
which together shall constitute one and the same instrument. This
Agreement may be executed by facsimile signature, which signature
shall be deemed of the same legal effect as an original hard copy
signature.
IRVINE SENSORS CORPORATION
a Delaware corporation
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John Carson,
President and Chief Executive Officer
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4
FORM OF RELEASE OF SECURITY
INTEREST
This release of
security interest is made and executed by
,
, (the “ Secured Party ”), in favor of Irvine
Sensors Corporation, a Delaware corporation (“ Debtor
”).
A. The Secured
Party loaned money to Debtor, and Debtor granted the Secured Party
a security interest in all of Debtor’s intellectual property
assets to secure indebtedness and obligations of Debtor to the
Secured Party.
B. The Secured
Party recorded its security interest as follows:
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Secured
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Execution
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Recordation
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Debtor
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Party
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Date
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Reel/Frame
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Date
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Irvine Sensors
Corporation
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NOW, THEREFORE,
for valuable consideration received, by its execution of this
Release of Security Interest, the Secured Party hereby irrevocably
and unconditionally releases all right, title and interest in all
of the following:
(a) the
patents and patent applications listed in Exhibit A (the
“ Patents ”);
(b) all
patents and patent applications (i) to which any of the
Patents directly or indirectly claims priority, (ii) for which
any of the Patents directly or indirectly forms a basis for
priority, and/or (iii) that directly or indirectly incorporate
by reference, or are directly or indirectly incorporated by
reference into, the Patents;
(c) all
reissues, reexaminations, extensions, continuations, continuations
in part, continuing prosecution applications, requests for
continuing examinations, divisions, registrations of any item in
any of the foregoing categories (a) and (b);
(d) all
non-United States patents, patent applications, and counterparts
relating to the Patents or any item in any of the foregoing
categories (a) through (c), including, without limitation,
certificates of invention, utility models, industrial design
protection, design patent protection, other governmental grants or
issuances, and any rights to apply in any or all countries of the
world for patents, certificates of invention, utility models,
industrial design protections, design patent protections, or
governmental grants or issuances of any type related to any of the
Patents and the inventions, invention disclosures, and discoveries
therein;
(e) inventions,
invention disclosures, and discoveries described in any of the
Patents of any item in the foregoing categories (a) though
(d);
(f) all
rights to apply in any or all countries of the world for patents,
certificates of invention, utility models, industrial design
protections, design patent protections, or other governmental
grants or issuances of any type related to any item in any of the
foregoing categories (a) through (e), including, without
limitation, under the Paris Convention for the Protection of
Industrial Property, the International Patent Cooperation Treaty,
or any other convention, treaty, agreement, or
understanding;
(g) causes of
action (whether known or unknown or whether currently pending,
filed, or otherwise) and other enforcement rights under, or on
account of, any of the Patents and/or the rights described in the
above subparagraphs (a) through (f), including, without
limitation, all causes of action and other enforcement rights
for
(ii) injunctive relief, and
(iii) any
other remedies of any kind
for past,
current and future infringement; and
(h) all
rights to collect royalties and other payments under or on account
of any of the Patents and/or any item in any of the foregoing
categories (a) through (g).
If necessary or
desired, the Secured Party hereby authorizes Debtor’s
authorized representative to file UCC Financing Statement
Amendment(s) with the applicable filing office(s) in order to
memorialize the release of any security interest related to the
items set forth in categories (a) through (h) by the
Secured Party.
This Release is
governed by the law of the State of Delaware, excluding its choice
of law principles to the contrary. This Release shall be binding
upon the Secured Party and its successors and assigns and inures,
to the benefit of, with respect to the Patents (including any
purchaser). The Secured Party acknowledges that it is aware that it
may hereafter discover facts different from or in addition to what
it now knows, believes or suspects to be true with respect to the
matters herein released, that such facts may give rise to claims,
causes of action, damages, consequences or results that are
unforeseen or unsuspected, and that the Secured Party is
nonetheless giving up its rights, and the releases in this Release
Agreement will be and remain in effect in all respects as complete,
general releases, notwithstanding any such different or additional
facts.
IN WITNESS
WHEREOF, the undersigned has executed this Release of Security
Interest on this
day of
2009.
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Title of Patent and
First
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Patent
or Application
No.
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Country
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Filing Date
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Named Inventor
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US
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8/10/1993
(2/6/1991)
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Hardware for
electronic neural network
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Carson, John
C.
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US
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5/14/2002
(12/30/1998)
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Neural
processing module with input architectures that make maximal use of
a weighted synapse array
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Carson, John
C.; Saunders, Christ H.
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US
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11/18/2003
(10/25/1999)
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Method of
producing a high quality, high resolution image from a sequence of
low quality, low resolution images that are undersampled and
subject to jitter
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Carlson,
Randolph S.; Arnold, Jack L.; Feldmus, Valentine G.
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US
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12/7/2004
(10/9/2001)
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High speed
multi-stage switching network formed from stacked switching layers
Carson, John C.; Ozguz, Volkan H.
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US
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7/25/2006
(1/17/2003)
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Method for
effectively embedding various integrated circuits within field
programmable gate arrays
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Carlson,
Randolph S.
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US
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2/15/2005
(1/17/2003)
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Field
programmable gate array with a variably wide word width
memory
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Ozguz, Volkan
H.; Carlson, Randolph S.; Gann, Keith D.; Leon, John P.
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Title of Patent and
First
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Patent
or Application
No.
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Country
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Filing Date
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Named Inventor
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US
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9/4/2007
(1/18/2005)
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Field
programmable gate array incorporating dedicated memory
stacks
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Carlson,
Randolph Stuart; Ozguz, Volkan; Gann, Keith D.; Leon, John
P.
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US
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4/16/1996
(9/13/1994)
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Infrared
wireless communication between electronic system components DeCaro,
Robert; Saunders, Christ H.; Maeding, Dale
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US
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6/3/1997
(9/11/1995)
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Sensing and
selecting observed events for signal processing
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Saunders,
Christ H.
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US
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2/27/2001
(2/26/1998)
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Stacking layers
containing enclosed IC chips
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Eide, Floyd
K.
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US
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9/3/1991
(6/6/1990)
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Analog to
digital conversion on multiple channel IC chips
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Wall, Llewellyn
E.
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US
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4/14/1992
(6/24/1991)
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Method of
fabricating electronic circuitry unit containing stacked IC layers
having lead rerouting
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Go, Tiong
C.(deceased,); Minahan, Joseph A.; Shanken, Stuart N.
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US
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1/18/1994
(12/24/1992)
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Method for
fabricating stacks of IC chips by segmenting a larger
stack
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Minahan, Joseph
A.; Pepe, Angel A.
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Title of Patent and
First
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Patent or Application
No.
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Country
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Filing Date
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Named Inventor
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US
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7/11/1995
(1/7/1994)
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Apparatus for
segmenting stacked IC chips
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Minahan, Joseph
A.
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US
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4/19/1994
(10/5/1992)
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Apparatus and
system for controllably varying image resolution to reduce data
output
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Arnold,
Jack
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US
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9/13/1994
(12/3/1992)
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Module
comprising IC memory stack dedicated to and structurally combined
with an IC microprocessor chip
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Carson, John
C.; Indin, Ronald J.; Shanken, Stuart N.
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US
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4/18/1995
(9/13/1993)
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Fabrication of
dense parallel solder bump connections
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Pepe, Angel A.;
Reinker, David M.; Minahan, Joseph A.
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US
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6/13/1995
(4/25/1994)
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Non-conductive
end layer for integrated stack of IC chips
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Miyake, Michael
K.
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US
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7/11/1995
(6/8/1994)
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Electronic
module comprising a stack of IC chips each interacting with an IC
chip secured to the stack
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Carson, John
C.; Some, Raphael R.
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US
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12/3/1996
(10/20/1994)
|
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Stack of IC
chips in lieu of single IC chip
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Ludwig, David
E.; Saunders, Christ H.; Some, Raphael R.; Stuart, John
J.
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Title of Patent and
First
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Patent or Application
No.
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Country
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Filing Date
|
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Named Inventor
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US
|
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11/18/1997
(3/26/1996)
|
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3D stack of IC
chips having leads reached by vias through passivation covering
access plane
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Johnson, Tony
K.
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US
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9/14/1999
(12/21/1996)
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Stackable
layers containing
encapsulated IC chips
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Camien, Andrew
N; Yamaguchi, James S.
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US
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6/6/2000
(5/21/1999)
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Stack of equal
layer neo-chips containing encapsulated IC chips of different
sizes
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Camien, Andrew
N.; Yamaguchi, James S.
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US
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9/21/1999
(10/5/1998)
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Multi-element
micro gyro
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Hsu, Ying W.;
Reeds, III, John W.; Saunders, Christ H.
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US
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7/18/2000
(4/29/1999)
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Multi-element
micro gyro
Hsu, Ying W.
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US
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6/17/2003
(6/26/2000)
|
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Multi-axis
micro gyro structure
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Hsu, Ying
Wen
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US
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1/11/2000
(6/10/1998)
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IC stack
utilizing BGA contacts
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Eide, Floyd
K.
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US
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2/22/2000
(6/10/1998)
|
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IC stack
utilizing secondary leadframes
Eide, Floyd K.
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US
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9/12/2000
(3/31/1999)
|
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Stackable
layers containing encapsulated chips
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Title of Patent and
First
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Patent or Application
No.
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Country
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Filing Date
|
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Named Inventor
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Yamaguchi,
James S.; Ozguz, Volkan H.; Camien, Andrew N.
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US
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|
11/5/2002
(5/11/2001)
|
|
Method and
apparatus for temperature compensation of an uncooled focal plane
array
|
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Kaufman,
Charles S.; Carson, Randolph S.; Hornback, William B.
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US
|
|
5/10/2005
(10/25/2002)
|
|
Method and
apparatus for temperature compensation of an uncooled focal plane
array
|
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|
|
|
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Kaufman,
Charles S.; Carson, Randolph S.; Hornback, William B.
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US
|
|
6/26/2007
(1/31/2005)
|
|
Imaging device
with multiple fields of view incorporating memory-based temperature
compensation of an uncooled focal plane array
|
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Hornback, Bert;
Harwood, Doug; Boyd, W. Eric; Carlson, Randy
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|
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|
US
|
|
7/22/2003
(8/3/2001)
|
|
Retro-reflector
warm stop for uncooled thermal imaging cameras and method of using
the same
|
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|
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Kaufman,
Charles S.
|
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US
|
|
3/16/2004
(5/10/2002)
|
|
Stackable
mi
|
|