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EX-10.3 TECHNOLOGY TRANSFER CONTRACT

Receivables Purchase Transfer Agreement

EX-10.3 TECHNOLOGY TRANSFER CONTRACT | Document Parties: CHINA AUTOMOTIVE SYSTEMS INC | Sensor System Solutions, Inc. | Hongkong Great Genesis Group Co., LTD You are currently viewing:
This Receivables Purchase Transfer Agreement involves

CHINA AUTOMOTIVE SYSTEMS INC | Sensor System Solutions, Inc. | Hongkong Great Genesis Group Co., LTD

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Title: EX-10.3 TECHNOLOGY TRANSFER CONTRACT
Date: 5/5/2005
Industry: Auto and Truck Parts     Sector: Consumer Cyclical

EX-10.3 TECHNOLOGY TRANSFER CONTRACT, Parties: china automotive systems inc , sensor system solutions  inc. , hongkong great genesis group co.  ltd
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                                                                    EXHIBIT 10.3

 

                          TECHNOLOGY TRANSFER CONTRACT

 

Party A (hereinafter "HX"): [CHINESE CHARACTERS]

 

Party B (hereinafter "3S"): Sensor System Solutions, Inc.

 

Party C (hereinafter "GENESIS"): Hongkong Great Genesis Group Co., LTD

 

Joint venture (hereinafter "USAI"): [CHINESE CHARACTERS](Universal Sensor

Application, Inc.)

 

OVERALL

 

1.1    All parties agree to establish a joint venture - Universal Sensor

      Application Inc. in the Wuhan East Lake development zone. This joint

      venture will combine 3S's advanced sensor manufacturing technology with

      superb position in the auto spare parts market of Hubei HengLong Group

      whose subsidiaries includes HX and GENESIS to produce sensor modules for

      domestic and foreign automotive market and other industries.

 

1.2    The registered capital of the joint venture will be USD 10 million. HX

      will invest USD 1 million in cash and other assets, 3S will invest USD 3

      million with technology and other related assets, and GENESIS will invest

      USD 6 million in cash and other assets. All parties will sign this

      agreement as an effective appendix of the joint venture contract.

 

TECHNOLOGY TO BE TRANSFERRED

 

2.1    All of 3S' existing sensor related technology.

 

2.2    Technology include but not limited to: Micro-Electro-Mechanical Systems

      (MEMS) integration technology, fabrication technology of MEMS silicon

      pressure sensor, MEMS vacuum package technology, thin film sensor

      technology, Silicon-on-Metal sensor technology, application specific

      integrated circuit for analog signal conditioning, etc.

 

TECHNOLOGY TRANSFER

 

3.1    3S will transfer above technology to USAI and will give USAI the exclusive

      right to use them in China. The right will be assessed and accounted for

      3S' USD 3 mil


 
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