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Lam Research

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1) CHANGE IN CONTROL AGREEMENT Effective July 1, 2009

Parties: Lam Research Corporation
Document Date: 7/31/2009
Industry: Semiconductors
Sector: Technology
Governing Law:California


2) EMPLOYMENT AGREEMENT

Parties: Lam Research Corporation
Document Date: 7/31/2009
Industry: Semiconductors
Sector: Technology
Governing Law:California


3) Amendment to Employment Agreement

Parties: Lam Research Corporation
Document Date: 2/6/2009
Industry: Semiconductors
Sector: Technology
Governing Law:California


4) LAM RESEARCH CORPORATION 2004 EXECUTIVE INCENTIVE PLAN

Parties: LAM RESEARCH CORPORATION
Document Date: 2/6/2009
Industry: Semiconductors
Sector: Technology


5) FIRST MODIFICATION AGREEMENT

Parties: BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 8/28/2008
Industry: Semiconductors
Sector: Technology


6) FIRST MODIFICATION AGREEMENT

Parties: BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 8/28/2008
Industry: Semiconductors
Sector: Technology


7) SECOND MODIFICATION AGREEMENT

Parties: BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 8/28/2008
Industry: Semiconductors
Sector: Technology


8) FIRST MODIFICATION AGREEMENT

Parties: BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 8/28/2008
Industry: Semiconductors
Sector: Technology


9) STOCK OPTION AMENDMENT AND SPECIAL BONUS AGREEMENT

Parties: Lam Research Corporation
Document Date: 5/8/2008
Industry: Semiconductors
Sector: Technology


10) PLEDGE AGREEMENT (LIVERMORE/ PARCEL 7) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


11) PLEDGE AGREEMENT (LIVERMORE/PARCEL 6) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


12) LEASE AGREEMENT (LIVERMORE/PARCEL 6) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | KLA-Tencor Corporation | LAM RESEARCH CORPORATION | Minimum Insurance
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


13) LEASE AGREEMENT (LIVERMORE/ PARCEL 7) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | KLA-Tencor Corporation | LAM RESEARCH CORPORATION | Minimum Insurance
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


14) CONSTRUCTION AGREEMENT (LIVERMORE/PARCEL 6) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


15) CONSTRUCTION AGREEMENT (LIVERMORE/PARCEL 7) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 18, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


16) LEASE AGREEMENT (FREMONT/BUILDING #4) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION | Ohio SELCO Service Corporation | Qualified Affiliate | Responsible Financial | Royal Bank of Scotland 27 Secured Spread 27 Subsidiary 27 Supplemental Payment 27 Supplemental Payment Obligation 27 Term 27 Transaction Expenses 27 Unfunded Benefit Liabilities 28 Unsecured Spread 28 ARTICLE II
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


17) PLEDGE AGREEMENT (FREMONT/BUILDING #4) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


18) PLEDGE AGREEMENT (FREMONT/BUILDING #1) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


19) LEASE AGREEMENT (FREMONT/BUILDING #1) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION | Ohio SELCO Service Corporation | Qualified Affiliate | Responsible Financial | Royal Bank of Scotland 27 Secured Spread 27 Subsidiary 27 Supplemental Payment 27 Supplemental Payment Obligation 27 Term 27 Transaction Expenses 27 Unfunded Benefit Liabilities 28 Unsecured Spread 28 ARTICLE II
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


20) LEASE AGREEMENT (FREMONT/BUILDING #2) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION | Ohio SELCO Service Corporation | Qualified Affiliate | Responsible Financial | Royal Bank of Scotland 27 Secured Spread 27 Subsidiary 27 Supplemental Payment 27 Supplemental Payment Obligation 27 Term 27 Transaction Expenses 27 Unfunded Benefit Liabilities 27 Unsecured Spread 27 ARTICLE II
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


21) PLEDGE AGREEMENT (FREMONT/BUILDING #2) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


22) LEASE AGREEMENT (FREMONT/BUILDING #3) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION | Ohio SELCO Service Corporation | Qualified Affiliate | Responsible Financial | Royal Bank of Scotland 27 Secured Spread 27 Subsidiary 27 Supplemental Payment 27 Supplemental Payment Obligation 27 Term 27 Transaction Expenses 27 Unfunded Benefit Liabilities 28 Unsecured Spread 28 ARTICLE II
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology
Governing Law:California


23) PLEDGE AGREEMENT (FREMONT/BUILDING #3) BETWEEN LAM RESEARCH CORPORATION (?LRC?) AND BNP PARIBAS LEASING CORPORATION (?BNPPLC?) December 21, 2007

Parties: LAM RESEARCH CORP | BNP PARIBAS LEASING CORPORATION | LAM RESEARCH CORPORATION
Document Date: 3/31/2008
Industry: Semiconductors
Sector: Technology


24) TRANSACTION AGREEMENT

Parties: Lam Research Corporation | SEZ Holding AG
Law Firm: Baker McKenzie
Document Date: 12/14/2007
Industry: Semiconductors
Sector: Technology


25) LAM RESEARCH CORPORATION 2007 Stock Incentive Plan Restricted Stock Unit Award Agreement Outside Directors

Parties: LAM RESEARCH CORP
Document Date: 4/30/2007
Industry: Semiconductors
Sector: Technology
Governing Law:California


26) LAM RESEARCH CORPORATION 2007 Stock Incentive Plan

Parties: LAM RESEARCH CORP
Document Date: 4/30/2007
Industry: Semiconductors
Sector: Technology
Governing Law:California


27) Employment Agreement

Parties: LAM RESEARCH CORP
Document Date: 4/30/2007
Industry: Semiconductors
Sector: Technology


28) EXHIBIT 10.106 2007 Stock Incentive Plan Restricted Stock Unit Award Agreement

Parties: LAM RESEARCH CORP
Document Date: 1/30/2007
Industry: Semiconductors
Sector: Technology
Governing Law:California


29) EXHIBIT 10.1 EMPLOYMENT AGREEMENT

Parties: LAM RESEARCH CORP | James W. Bagley
Document Date: 12/15/2006
Industry: Semiconductors
Sector: Technology
Governing Law:Texas


30) EMPLOYMENT AGREEMENT

Parties: Lam Research Corporation
Document Date: 12/15/2006
Industry: Semiconductors
Sector: Technology
Governing Law:Texas


31) 2007 Stock Incentive Plan of Lam Research Corporation As Amended by the Board of Directors on November 2, 2006

Parties: LAM RESEARCH CORP
Document Date: 11/8/2006
Industry: Semiconductors
Governing Law:Delaware


32) ASSET PURCHASE AGREEMENT

Parties: LAM RESEARCH CORP | BULLEN ULTRASONICS, INC., | EATON 122 LTD., | BULLEN SEMICONDUCTOR (SUZHOU) CO., LTD., | MARY A. BULLEN, | VICKI A. BROWN
Law Firm: Coolidge, Wall Co., L.P.A.; Dinsmore & Shohl LLP
Document Date: 10/10/2006
Industry: Semiconductors
Governing Law:Ohio


33) FIRST AMENDMENT TO ASSET PURCHASE AGREEMENT

Parties: LAM RESEARCH CORP | Eaton 122 Ltd | Bullen Semiconductor (Suzhou) Co., Ltd
Document Date: 10/10/2006
Industry: Semiconductors


34) 1997 STOCK INCENTIVE PLAN

Parties: LAM RESEARCH CORP
Document Date: 11/8/2005
Industry: Semiconductors
Sector: Technology


35) FOR IMMEDIATE RELEASE

Parties: LAM RESEARCH CORP
Document Date: 8/26/2005
Industry: Semiconductors
Sector: Technology


36) FOR IMMEDIATE RELEASE

Parties: LAM RESEARCH CORP
Document Date: 6/30/2005
Industry: Semiconductors
Sector: Technology


37) AMENDED AND RESTATED GUARANTY

Parties: LAM RESEARCH CORP
Document Date: 9/10/2004
Industry: Semiconductors
Sector: Technology
Governing Law:California


38) LAM RESEARCH CORPORATION NONSTATUTORY STOCK OPTION AGREEMENT

Parties: LAM RESEARCH CORP
Document Date: 9/10/2004
Industry: Semiconductors
Sector: Technology


39) SECOND AMENDMENT TO SECOND AMENDED AND RESTATED UNCOMMITTED INSURED TRADE RECEIVABLES PURCHASE AGREEMENT THIS SECOND AMENDMENT TO SECOND AMENDED AND RESTATED UNCOMMITTED INSURED

Parties: LAM RESEARCH CORP
Document Date: 9/10/2004
Industry: Semiconductors
Sector: Technology
Governing Law:California


40) AGREEMENT ON OUTSTANDING ASPECT PAYABLES

Parties: DND TECHNOLOGIES INC | Lam Research Corporation,
Document Date: 8/17/2004


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