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INTELLECTUAL PROPERTY SECURITY AGREEMENT

Intellectual Property IP Rights Security Agreement

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TRIPATH TECHNOLOGY INC

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Title: INTELLECTUAL PROPERTY SECURITY AGREEMENT
Date: 8/9/2005
Industry: SEMICO     Sector: TECHNO

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Intellectual Property Security Agreement

Exhibit 10.2

 

INTELLECTUAL PROPERTY SECURITY AGREEMENT

 

This INTELLECTUAL PROPERTY SECURITY AGREEMENT, dated as of August 4, 2005, (the “Agreement”) between BRIDGE BANK, NATIONAL ASSOCIATION (“Lender”) and Tripath Technology Inc., (“Grantor”) is made with reference to the Business Financing Agreement, dated as of August 4, 2005 (as amended from time to time, the “Financing Agreement”), between Lender and Grantor. Terms defined in the Financing Agreement have the same meaning when used in this Agreement.

 

For good and valuable consideration, receipt of which is hereby acknowledged, Grantor hereby covenants and agrees as follows:

 

To secure the Obligations under the Financing Agreement, Grantor grants to Lender a security interest in all right, title, and interest of Grantor in any of the following, whether now existing or hereafter acquired or created in any and all of the following property (collectively, the “Intellectual Property Collateral”):

 

(a) copyright rights, copyright applications, copyright registrations and like protections in each work or authorship and derivative work thereof, whether published or unpublished and whether or not the same also constitutes a trade secret, now or hereafter existing, created, acquired or held (collectively, the “Copyrights”), including the Copyrights described in Exhibit A;

 

(b) trademark and servicemark rights, whether registered or not, applications to register and registrations of the same and like protections, and the entire goodwill of the business of Borrower connected with and symbolized by such trademarks (collectively, the “Trademarks”), including the Trademarks described in Exhibit B;

 

(c) patents, patent applications and like protections including without limitation improvements, divisions, continuations, renewals, reissues, extensions and continuations-in-part of the same (collectively, the “Patents”), including the Patents described in Exhibit C;

 

(d) mask work or similar rights available for the protection of semiconductor chips or other products (collectively, the “Mask Works”);

 

(e) trade secrets, and any and all intellectual property rights in computer software and computer software products;

 

(f) design rights;

 

(g) claims for damages by way of past, present and future infringement of any of the rights included above, with the right, but not the obligation, to sue for and collect such damages for said use or infringement of the intellectual property rights identified above;

 

(h) licenses or other rights to use any of the Copyrights, Patents, Trademarks, or Mask Works, and all license fees and royalties arising from such use to the extent permitted by such license or rights;

 

(i) amendments, renewals and extensions of any of the Copyrights, Trademarks, Patents, or Mask Works; and

 

(j) proceeds and products of the foregoing, including without limitation all payments under insurance or any indemnity or warranty payable in respect of any of the foregoing.

 

The rights and remedies of Lender with respect to the security interests granted hereunder are in addition to those set forth in the Financing Agreement, and those which are now or hereafter available to Lender as a matter of law or equity. Each right, power and remedy of Lender provided for herein or in the Financing Agreement, or now or hereafter existing at law or in equity shall be cumulative and concurrent and shall be in addition to every right, power or remedy provided for herein, and the exercise by Lender of any one or more of such rights, powers or remedies does not preclude the simultaneous or later exercise by Lender of any other rights, powers or remedies.


IN WITNESS WHEREOF, the parties have executed this Agreement as of the date first written above.

 

 

 

 

 

 

 

 

GRANTOR:

 

 

 

LENDER:

 

 

 

TRIPATH TECHNOLOGY INC.

 

 

 

BRIDGE BANK, NATIONAL ASSOCIATION

 

 

 

 

By:

 

/s/ Dr. Adya S. Tripathi


 

By:

 

/s/ Michael Lederman


Name:

 

Dr. Adya S. Tripathi

President and Chief Executive Officer,

Chairman of the Board

 

Name:

 

Michael Lederman


 

 

 

Title:

 

Vice President


 

 

 

 

Address for Notices:

  

Address for Notices:

 

 

Attn: Jeffrey L. Garon

  

Attn: Lee Shodiss

Vice President, Finance and Chief Financial Officer

  

2120 El Camino Real

2560 Orchard Parkway

  

Santa Clara, CA 95050

San Jose, CA 95131

  

Tel: (408) 556-6502

Tel: (408) 750-3000

  

Fax: (408) 423-8510

Fax: (408) 750-3001

  

 


EXHIBIT A

 

COPYRIGHTS

 

 

 

 

Title:

 

A new technique for audio amplification and signal processing

Claimant:

 

Dr Adya S. Tripathi

Registered:

 

May 24, 1985

 

 

 

 


EXHIBIT B

 

TRADEMARKS

 

 

 

 

 

 

 

 

Country


    

Status


    

Trademark


  

Reg. No.


 

 

 

 

Canada

    

Abandoned

    

COMBINANT DIGITAL

  

 

 

 

 

 

Canada

    

Abandoned

    

DESIGN (T)

  

 

 

 

 

 

Canada

    

Abandoned

    

TRIPATH

  

 

 

 

 

 

China

    

Registered

    

COMBINANT

  

1513827

 

 

 

 

China

    

Registered

    

COMBINANT

  

1445662

 

 

 

 

China

    

Registered

    

DESIGN (T)

  

1505735

 

 

 

 

China

    

Registered

    

DESIGN (T)

  

1436813

 

 

 

 

China

    

Registered

    

TRIPATH

  

1654287

 

 

 

 

China

    

Abandoned

    

TRIPATH TECHNOLOGY

  

 

 

 

 

 

China

    

Abandoned

    

TRIPATH TECHNOLOGY

  

 

 

 

 

 

China

    

Aband Inst

    

TRIPATH TECHNOLOGY

  

1538082

 

 

 

 

European Community

    

Regd-DNR

    

COMBINANT DIGITAL

  

1089366

 

 

 

 

European Community

    

Registered

    

DESIGN (T)

  

001089663

 

 

 

 

European Community

    

Registered

    

TRIPATH

  

1812890

 

 

 

 

European Community

    

Registered

    

TRIPATH TECHNOLOGY

  

1089028

 

 

 

 

Hong Kong

    

Regd-DNR

    

COMBINANT DIGITAL

  

2011/2001

 

 

 

 

Hong Kong

    

Abandoned

    

COMBINANT DIGITAL

  

 

 

 

 

 

Hong Kong

    

Renewed

    

DESIGN (T)

  

200016783

 

 

 

 

Hong Kong

    

Renewed

    

DESIGN (T)

  

4304/2002

 

 

 

 

Hong Kong

    

Abandoned

    

TRIPATH

  

 

 

 

 

 

Hong Kong

    

Abandoned

    

TRIPATH

  

 

 

 

 

 

Japan

    

Regd-DNR

    

COMBINANT DIGITAL

  

4426096

 

 

 

 

Japan

    

Registered

    

DESIGN (T)

  

4426095

 

 

 

 

Japan

    

Registered

    

TRIPATH

  

4532845

 

 

 

 

Japan

    

Registered

    

TRIPATH TECHNOLOGY

  

4434289

 

 

 

 

Korea

    

Regd-DNR

    

COMBINANT DIGITAL

  

1293

 

 

 

 

Korea

    

Registered

    

DESIGN (T)

  

1292

 

 

 

 

Korea

    

Registered

    

TRIPATH TECHNOLOGY

  

1176

 

 

 

 

Singapore

    

Abandoned

    

COMBINANT DIGITAL

  

 

 

 

 

 

Singapore

    

Regd-DNR

    

COMBINANT DIGITAL

  

T99/01775D

 

 

 

 

Singapore

    

Registered

    

DESIGN (T)

  

T99/01772Z

 

 

 

 

Singapore

    

Registered

    

DESIGN (T)

  

T99/01773H

 

 

 

 

Singapore

    

Registered

    

TRIPATH

  

T00/08697Z

 

 

 

 

Singapore

    

Abandoned

    

TRIPATH TECHNOLOGY

  

 

 

 

 

 

Singapore

    

Aband Inst

    

TRIPATH TECHNOLOGY

  

 

 

 

 

 

Taiwan

    

Regd-DNR

    

COMBINANT DIGITAL

  

 

 

 

 

 

Taiwan

    

Regd-DNR

    

COMBINANT DIGITAL

  

00133792

 

 

 

 

Taiwan

    

Registered

    

DESIGN (T)

  

00903068

 

 

 

 

Taiwan

    

Registered

    

DESIGN (T)

  

00130297

 

 

 

 

Taiwan

    

Registered

    

TRIPATH

  

984786

 

 

 

 

Taiwan

    

Registered

    

TRIPATH TECHNOLOGY

  

00915918

 

 

 

 

Taiwan

    

Registered

    

TRIPATH TECHNOLOGY

  

00127054

 

 

 

 

US

    

Registered

    

CLASS-T